JPS615909A - 熱硬化性樹脂成形品の製造方法,成形金型および製造設備 - Google Patents

熱硬化性樹脂成形品の製造方法,成形金型および製造設備

Info

Publication number
JPS615909A
JPS615909A JP12695284A JP12695284A JPS615909A JP S615909 A JPS615909 A JP S615909A JP 12695284 A JP12695284 A JP 12695284A JP 12695284 A JP12695284 A JP 12695284A JP S615909 A JPS615909 A JP S615909A
Authority
JP
Japan
Prior art keywords
mold
resin
molding
injection port
resin injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12695284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0257006B2 (en]
Inventor
Yukio Takahashi
幸雄 高橋
Zenjiro Kawase
川瀬 善次郎
Yasuo Deura
出浦 康男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chichibu Fuji Co Ltd
Original Assignee
Chichibu Fuji Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chichibu Fuji Co Ltd filed Critical Chichibu Fuji Co Ltd
Priority to JP12695284A priority Critical patent/JPS615909A/ja
Publication of JPS615909A publication Critical patent/JPS615909A/ja
Publication of JPH0257006B2 publication Critical patent/JPH0257006B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03Injection moulding apparatus
    • B29C45/04Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0433Injection moulding apparatus using movable moulds or mould halves mounted on a conveyor belt or chain

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP12695284A 1984-06-20 1984-06-20 熱硬化性樹脂成形品の製造方法,成形金型および製造設備 Granted JPS615909A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12695284A JPS615909A (ja) 1984-06-20 1984-06-20 熱硬化性樹脂成形品の製造方法,成形金型および製造設備

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12695284A JPS615909A (ja) 1984-06-20 1984-06-20 熱硬化性樹脂成形品の製造方法,成形金型および製造設備

Publications (2)

Publication Number Publication Date
JPS615909A true JPS615909A (ja) 1986-01-11
JPH0257006B2 JPH0257006B2 (en]) 1990-12-03

Family

ID=14947953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12695284A Granted JPS615909A (ja) 1984-06-20 1984-06-20 熱硬化性樹脂成形品の製造方法,成形金型および製造設備

Country Status (1)

Country Link
JP (1) JPS615909A (en])

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04286613A (ja) * 1990-11-30 1992-10-12 Gencorp Inc 連続成形法及びその装置
JPH0639872A (ja) * 1991-10-10 1994-02-15 Gencorp Inc 射出成型機用往復移動体装置
WO2014156917A1 (ja) * 2013-03-26 2014-10-02 Nok株式会社 成形装置
JP2015168175A (ja) * 2014-03-07 2015-09-28 株式会社エムティアール 軸受部材のライナー注入装置
US9516746B2 (en) 2011-11-22 2016-12-06 Panasonic Intellectual Property Management Co., Ltd. Metal-clad laminate and printed wiring board
US11393623B2 (en) 2018-07-31 2022-07-19 Mitsui High-Tec, Inc. Method for manufacturing iron core product

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007060892A1 (ja) * 2005-11-25 2007-05-31 Dai-Ichi Seiko Co., Ltd. 樹脂封止装置及び樹脂封止方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5772832A (en) * 1980-10-25 1982-05-07 Yamashiro Seiki Seisakusho:Kk Injection molding machine
JPS5858515U (ja) * 1981-10-16 1983-04-20 株式会社山城精機製作所 射出成形機

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5772832A (en) * 1980-10-25 1982-05-07 Yamashiro Seiki Seisakusho:Kk Injection molding machine
JPS5858515U (ja) * 1981-10-16 1983-04-20 株式会社山城精機製作所 射出成形機

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04286613A (ja) * 1990-11-30 1992-10-12 Gencorp Inc 連続成形法及びその装置
JPH0639872A (ja) * 1991-10-10 1994-02-15 Gencorp Inc 射出成型機用往復移動体装置
US9516746B2 (en) 2011-11-22 2016-12-06 Panasonic Intellectual Property Management Co., Ltd. Metal-clad laminate and printed wiring board
WO2014156917A1 (ja) * 2013-03-26 2014-10-02 Nok株式会社 成形装置
US9895835B2 (en) 2013-03-26 2018-02-20 Nok Corporation Molding apparatus
JP2015168175A (ja) * 2014-03-07 2015-09-28 株式会社エムティアール 軸受部材のライナー注入装置
US11393623B2 (en) 2018-07-31 2022-07-19 Mitsui High-Tec, Inc. Method for manufacturing iron core product
EP3603926B1 (en) * 2018-07-31 2022-09-28 Mitsui High-Tec, Inc. Method and apparatus for injection moulding an iron core product

Also Published As

Publication number Publication date
JPH0257006B2 (en]) 1990-12-03

Similar Documents

Publication Publication Date Title
KR100429046B1 (ko) 에폭시수지로캡슐화된반도체장치의제조방법
JPS5850582B2 (ja) 半導体封入成形方法とその金型装置
GB2252746A (en) Resin sealing of electronic parts
US6068809A (en) Method of injection molding elements such as semiconductor elements
JP2004216558A (ja) 電子部品の樹脂封止成形方法及び装置
WO1995019251A1 (fr) Procede de soudage par resine de dispositifs semi-conducteurs
JPS615909A (ja) 熱硬化性樹脂成形品の製造方法,成形金型および製造設備
US20010003385A1 (en) Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein
JPS588625A (ja) 熱硬化性材料のランナ−レス射出圧縮成形装置
GB2104827A (en) Molding of electronic components
KR20190075797A (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
EP0870588A1 (en) Resin molding apparatus
JPS6146051B2 (en])
EP1259981B1 (en) Device and method for encapsulating electronic components mounted on a carrier
JP2683204B2 (ja) 樹脂パッケージング方法及びその装置
JP2666630B2 (ja) 半導体装置の製造方法
JPS5821345A (ja) 電子部品の樹脂封止方法
JPH0716879A (ja) 電子部品モールド金型
JPH10146870A (ja) 樹脂成形装置
JP2706914B2 (ja) 電子部品の樹脂封止成形方法及び金型
JPS5967639A (ja) 半導体樹脂封止用金型
JP2694293B2 (ja) 高圧縮成形樹脂タブレットの成形方法
JPS6146050B2 (en])
GB2280144A (en) Apparatus for sealing semiconductor devices
JP3007850B2 (ja) 樹脂成形方法及び樹脂成形装置